By Wen-Yee Lee
TAIPEI, July 30 (Reuters) – Taiwan’s ASE Technology Holding, the world’s largest chip packaging and testing provider, said on Thursday it would raise this year’s capital expenditure by $2 billion to around $10.5 billion, driven by strong demand.
• Its previous capital expenditure guidance was $8.5 billion.
• Of the additional $2 billion, $1 billion will go toward facilities and $1 billion toward equipment.
• The company said it is building 13 greenfield sites this year and has another eight brownfield sites, where it acquired existing factories and is repurposing them to meet demand.
• The company said revenue from its leading-edge advanced packaging (LEAP) business is “tracking ahead” of its prior 2026 guidance of $3.5 billion.
• Chief Financial Officer Joseph Tung said the company aims to double its LEAP business revenue in 2027, driven by strong business momentum.
• ASE said AI is enabling new applications and driving demand for new hardware, while boosting demand for industrial, power, connectivity and storage devices.
• The holding company’s subsidiary Siliconware Precision Industries (SPIL) is a major packaging supplier for Nvidia’s AI chips.
• ASE on Thursday also reported second-quarter revenue of T$191.06 billion ($5.88 billion), up 27% from a year earlier, while net income was up 180% at T$21.068 billion.
• ASE’s shares have risen 101.6% so far this year, far outperforming a 37.87% rise in the broader market. The company’s shares closed up 1.2% on Thursday ahead of its earnings release.
(Reporting by Wen-Yee Lee; Editing by Clarence Fernandez AND dAVID hOLMES)
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